Visitors to the Flint Group/Xeikon booth, 6419 in Hall F, can meet the teams and learn about print technologies that minimize energy consumption, reduce waste, streamline operations and promote circularity.

XSYS showcased its wide range of solutions, which have been designed to reshape the future of label and packaging printing.

The single-step IML technology achieves a seamless part decoration right in the injection mold, where the label becomes an integral component of the packaging itself.

This marks the next stage of the Avery Dennison innovation journey, enabling the industry to drive to a more sustainable and connected future.

Visitors are cordially invited to experience thermoscript® thermal papers and jetscript® inkjet papers for label applications, as well as barricote® barrier papers for flexible packaging of food and non-food at booth 6A09. 

Company notes that Latin American demand for different printed products, including labels and packaging, especially highly embellished, sophisticated ones, has started to grow significantly.

Davis-Standard will be exhibiting at booth #1041 during Labelexpo Americas 2022 in Rosemont, Illinois, September 13-15.

Visitors of booth #749 will learn about the many bio-renewable, compostable and recyclable products under Sun Chemical’s SunEco portfolio of solutions.